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23FUN01 PhoQuS-T Project

This project aims to develop integrated optical practical primary thermometry from 4 K to 500 K to enable in-situ traceability in further practical applications.

This 36-months project started 1st Septempber 2024. The consortium brings together 16 European Parthers and is coordinated by LNE, France.

The project 23FUN01 PhoQuS-T has received funding from the European Partnership on Metrology, co-financed from the European Union’s Horizon Europe Research and Innovation Programme and by the Participating States.

OVERVIEW

Temperature is one of the most frequently and widely used measurements and it influences almost every physical, chemical, and biological process. This project aims to take advantage of the kelvin redefinition by developing novel small-scale optical based primary thermometry approaches for the dissemination of thermodynamic temperature to industries such as semiconductor, micro- and nanotechnology, aerospace and naval, green energy and quantum technologies. It will significantly progress the state of the art by a) combining complementary photonic thermometry techniques (quantum opto-mechanics, optical phase noise, and photothermal effect) for the first time, b) investigating several sensor geometries (1D, 2D) and materials (e.g., Si, SiN, GaP, InP) of micro- and nano-sensing structures and c) extending the operating temperature range from 4 K to 500 K. In addition, the project will demonstrate practical quantum applications of the developed temperature sensors for ion trap monitoring and in quantum-based pressure standard.

THE NEED FOR THE PROJECT

The kelvin redefinition has stimulated new and disruptive approaches to delivering temperature traceability, namely practical primary thermometry at the point of measurement. Such approaches better meet user needs by providing lifetime on-demand reliable traceable temperatures. The most innovative ways to provide such traceability are the photonic/quantum-based approaches investigated in this project (in particular, thanks to the high chipset integration capacity and the self-calibration). Whilst in their infancy capacity these approaches have the potential to radically change the practice of thermometry through provision of in situ traceability without the need for sensor removal for recalibration. Beside purely metrological need for a practical primary wide-range thermometer for the realisation and dissemination of the thermodynamic temperature according to the mise-en-pratique for the definition of the kelvin, multiple users would benefit from such an approach: from quantum technologies community to cryogenics, photonic/semiconductor, aerospace, transportation and energy (hydrogen) sectors. The sensors developed in this project are adapted to these applications where usual temperature sensors are unsuitable: self-calibrated optomechanical resonators as well as photonic resonators could provide robust, small-scale and wide-temperature range sensors, immune to electrical noise and easy to integrate.

SCIENTIFIC OBJECTIVES

The overall objective of the project is to develop integrated optical practical primary thermometry with a combination of different approaches: with the optomechanical sensor, the quantum thermometry below 10 K will provide a quantum reference for the optical noise thermometry (operating in the range 4 K to 300 K), whilst using the high resolution photonic (ring-resonator) sensor the temperature range will be extended up to 500 K.

  1. To develop optical noise thermometry from 4 K to 300 K with a target temperature uncertainty of 0.1 K, by using 1D (nanobeam) or 2D (membrane) optomechanical sensors and to test quantum thermometry below 10 K, in order to provide a quantum reference for noise thermometry. In addition, to design, fabricate and characterise sensors using different mathematical models. (WP1)
  2. To extend the range for photonic thermometry from 80 K to 500 K, based on passive and novel active photonic integrated circuits of micro- and nano-resonators. To design, simulate, manufacture, and characterise (thermally and optically) the unpackaged photonic chip-based sensors, with a target Q factor of 107. In addition, to develop and test enhanced read-out techniques, including reliable experimental set-ups and theoretical modelling. (WP2)
  3. To develop integrated packaging (below cm3) for optomechanical and photonic sensors and to develop robust fibre to chip coupling over the temperature range from 4 K to 500 K by investigating different technologies for direct fibre coupling (laser welding, gluing, mechanical support) to minimise the optical loss and achieve negligible strain effects over this temperature range. (WP3)
  4. To validate the fabricated primary optomechanical sensors from Objective 1 and to calibrate the interpolating sensors from Objective 1 and 2 traceable to the international temperature scale (ITS-90). Then to evaluate the corresponding uncertainty budgets for optomechanical and photonic sensors in their respective operating ranges. In addition, to demonstrate the application of the calibrated photonic sensors in relevant quantum applications, such as in ion trap monitoring and quantum-based pressure standard. (WP4)
  5. To facilitate the take up of the technology and measurement infrastructure developed in the project by the measurement supply chain (photonic and optomechanical temperature sensors, accredited laboratories, instrument manufacturers), research organisations, standards developing organisations (CIPM Consultative Committee for Thermometry (CCT), EURAMET and other RMO TC-Ts) and end users (academia, national metrology institutes, industrial R&D laboratories. (WP5).

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